VisionPower Semiconductor Begins Risk Production at Singapore 300mm Fab

VisionPower Semiconductor Manufacturing Co. Pte. Ltd. (VSMC), a joint venture between Vanguard International Semiconductor Corp. and NXP Semiconductors, has commenced risk production at its first 12-inch (300mm) semiconductor fabrication plant in Tampines, Singapore, signalling progress towards volume production in early 2027.

New Fab Supports Specialty IC Production With Advanced Processes

Constructed over 22 months following its groundbreaking in December 2024, the fab has processed its initial sample lot with yields exceeding 99%. It will produce semiconductor devices using process nodes from 130nm to 40nm, targeting mixed-signal, power management, analog, and interposer applications. These components are intended for sectors including high-performance computing, mobile, automotive, industrial, and consumer electronics.

At full operational capacity, planned for 2029, the facility will manufacture approximately 44,000 300mm wafers per month and employ around 1,600 staff.

Facility Designed for Automation, Sustainability, and Workforce Development

The facility incorporates automated manufacturing supported by AI and digital management systems. It meets LEED and Singapore Green Mark environmental standards through renewable energy integration, energy efficiency measures, and water recycling programmes.

VSMC has established collaborations with Singapore’s institutes of higher learning, including memorandums of understanding for research and workforce development initiatives such as internships and professional training programmes.

According to VSMC and its partners, the new fab enhances Singapore’s semiconductor manufacturing capacity, contributes to supply chain resilience, and supports the local high-tech industry.

VSMC and NXP executives noted the plant will strengthen geographic supply resilience and support long-term customer demand, aligning with hybrid manufacturing strategies focused on sustainable growth and the development of intelligent edge computing technologies.

Looking ahead, volume production is scheduled to commence in the first quarter of 2027, with capacity expansions expected by 2029 to meet increasing demand for specialty ICs in regional and global markets.